(China) YYP 82 Anangakini Amandla Ebhondi Amandla

Incazelo emfushane:

  1. Iukunqunyelwa

 

Amandla e-Interlayer Bond abhekisa emandleni eBhodi ukumelana nokuhlukaniswa kokuhlangene futhi kuboniswa kwekhono lebhonde langaphakathi lePhepha, okubaluleke kakhulu ukucubungula iphepha nekhadibhodi ye-multilayer nekhadibhodi.

Amanani aphansi noma angasatshalaliswanga kahle amanani eBonding angaphakathi angadala izinkinga zephepha nekhadibhodi lapho zifaka imishini yokuphrinta ye-offset usebenzisa ama-inkive inks;

Amandla amakhulu abusayo azoletha ubunzima bokucutshungulwa nokwandisa izindleko zokukhiqiza.

II.Scope of isicelo

IBox Board, Ibhodi Elimhlophe, Iphepha Lebhokisi Elimpunga, Iphepha Elimhlophe Lamakhadi


Imininingwane Yomkhiqizo

Amathegi Omkhiqizo

Amapharamitha Ezobuchwepheshe:

Hlinzeka ngogesi

I-AC (100 ~ 240) v, (50/60) Hz 50w

Indawo Yokusebenza

Lokushisa (10 ~ 35) ℃, umswakama ohlobene ≤ 85%

Umthombo womoya

≥.4MPA

Isikrini sokubonisa

Isikrini sokuthinta esingu-7 inch

Usayizi wesampula

25.4mm * 25.4mm

I-Specimen Holding Force

0 ~ 60kg / cm² (akwazi ukuguqulwa)

I-Impact Angle

I-90 °

isixazululo

I-0.1J / m²

Ibanga lokulinganisa

Ibanga A: (20 ~ 500) J / M²; Ibanga B: (500 ~ 1000) j / m²

Iphutha lenkomba

Ibanga A: ± 1J / M² grade B: ± 2J / M²

Umuvo

J / m²

Ukugcinwa kwedatha

Ingagcina ama-16,000 ama-batch of datch;

Imininingwane ephezulu engu-20 yokuhlola i-batch ngayinye

Isikhombimsebenzisi esibonakalayo

I-RS232

Umshini wokubhala

Iphrinta eshisayo

Ubukhulu

460 × 310 × 515 mm

Isisindo sengqikithi

I-25kg




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